China Wafer Level CSP Hits Day High with 4.45% Surge

China Wafer Level CSP Co., Ltd. has experienced a notable increase of 4.45% on February 26, 2026, reaching an intraday high of CNY 35.84. This performance stands in contrast to the China Shanghai Composite, which declined by 1.26% on the same day. Over the past week, the stock has surged by 11.46%, and its monthly performance shows a robust increase of 17.13%, indicating a strong short-term trend. Despite a challenging year, where the stock has seen a decline of 2.49%, it has demonstrated resilience with a year-to-date performance of 27.33%. The company has reported positive results for the last three consecutive quarters, with operating cash flow reaching a high of CNY 544.48 million and a return on capital employed (ROCE) of 7.81%. Additionally, raw material costs have decreased by 28.27% year-over-year, contributing to improved profitability. With a market capitalization of CNY 20,606 million, China Wafer Level CSP Co., Ltd. operates within the Other Electrical Equipment industry and maintains a price-to-earnings ratio of 69.00. The stock's current dividend yield stands at 0.27%, reflecting its commitment to returning value to shareholders.